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Multi-Die System

Our Multi-Die System experts share insights to help you navigate through the challenges of heterogeneous integration to deliver systems for hyperscale data centers, AI, and other compute-intensive applications.

Stories

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Shekhar Kapoor

Manuel Mota

Kenneth Larsen

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Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

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4 min read/May 15, 2025

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Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

By Frank Malloy

Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Design

Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm

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2 min read/Feb 06, 2025

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Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm

By Arun Bhattacharya

Tags: Multi-Die System, Chip Design Insights, Design, Interface IP, Foundation IP, Silicon IP

Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025

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2 min read/Jan 21, 2025

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Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025

By Shekhar Kapoor, Michael Posner

Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Compiler

Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances

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5 min read/Jan 09, 2025

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Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances

By Faisal Goriawalla, Yervant Zorian

Tags: Multi-Die System, Silicon Lifecycle Management, Chip Design Insights, Interface IP, Silicon IP

Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design

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2 min read/Dec 05, 2024

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Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design

By Synopsys Editorial Staff

Tags: Multi-Die System, Chip Design Insights, Design, Manufacturing, Foundation IP, HPC, Data Center, Silicon IP, 3DIC Design

Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs

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4 min read/Sep 09, 2024

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Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs

By Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Interface IP, Silicon IP

UCIe 2.0 - Setting the Tone for Chiplet Interoperability

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3 min read/Aug 08, 2024

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UCIe 2.0 - Setting the Tone for Chiplet Interoperability

By Prasad Subudhi K. S, Deepak Nagaria, Narasimha Babu G V L

Tags: Verification Central, Multi-Die System, Verification IP, Verification

Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets

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4 min read/Jun 17, 2024

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Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets

By Manmeet Walia, Erez Shaizaf, Manuel Mota

Tags: Multi-Die System, Chip Design Insights

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

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5 min read/Jun 12, 2024

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GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

By Synopsys Editorial Staff, WeiHsun Liao

Tags: Customer Spotlight, Multi-Die System, Chip Design Insights, Design, 3DIC Design

Want to Mix and Match Dies in a Single Package? UCIe Can Get You There

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3 min read/Apr 25, 2024

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Want to Mix and Match Dies in a Single Package? UCIe Can Get You There

By Michael Posner, Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Interface IP, Silicon IP

Faster, Higher Capacity Emulation and Prototyping for AI Workloads

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4 min read/Mar 20, 2024

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Faster, Higher Capacity Emulation and Prototyping for AI Workloads

By Samskrut Konduru

Tags: Multi-Die System, AI & Machine Learning, Product Spotlight, Prototyping, Chip Design Insights, Emulation, Verification

Industry Leaders Discuss “Overcoming the Challenges of Multi-die Systems Verification”

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8 min read/Mar 15, 2024

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Industry Leaders Discuss “Overcoming the Challenges of Multi-die Systems Verification”

By Verification Expert

Tags: Verification Central, Multi-Die System, Verification

Industry's First Verification IP for Arm AMBA CHI-G

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5 min read/Mar 06, 2024

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Industry's First Verification IP for Arm AMBA CHI-G

By Sudhanshu Rao

Tags: Verification Central, Multi-Die System, Verification IP, Verification

Synopsys AMBA CHI C2C System Verification Solutions

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5 min read/Feb 22, 2024

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Synopsys AMBA CHI C2C System Verification Solutions

By Venkatesh Kudumula

Tags: Verification Central, Multi-Die System, Verification IP, Verification

Avoiding Multi-Die System Re-spins with New Early Architecture Exploration Technology

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4 min read/Jan 23, 2024

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Avoiding Multi-Die System Re-spins with New Early Architecture Exploration Technology

By Kamal Desai

Tags: Multi-Die System, Chip Design Insights, Design, Platform

Can 3DHI Meet the Demands of Aerospace and Government Applications?

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5 min read/Jan 22, 2024

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Can 3DHI Meet the Demands of Aerospace and Government Applications?

By Kenneth Larsen, Ian Land, Rob Aitken

Tags: Multi-Die System, Aerospace & Government, Chip Design Insights, Design

2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation

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8 min read/Dec 20, 2023

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2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation

By Synopsys Editorial Staff

Tags: Cloud, Multi-Die System, AI & Machine Learning, Chip Design Insights

Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip

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4 min read/Dec 14, 2023

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Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip

By Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Interface IP, Silicon IP

What’s Next for Multi-Die Systems in 2024?

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5 min read/Dec 13, 2023

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What’s Next for Multi-Die Systems in 2024?

By Shekhar Kapoor

Tags: Multi-Die System, Chip Design Insights

How Photonics Can Light the Way for Higher Performing Multi-Die Systems

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5 min read/Nov 21, 2023

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How Photonics Can Light the Way for Higher Performing Multi-Die Systems

By Kenneth Larsen, Twan Korthorst

Tags: Multi-Die System, Chip Design Insights, Design, Photonic

Ensuring the Health and Reliability of Multi-Die Systems

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7 min read/Oct 11, 2023

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Ensuring the Health and Reliability of Multi-Die Systems

By Randy Fish, Yervant Zorian, Manuel Mota, Guy Cortez

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, HPC, Data Center

Industry Insights: How Collaboration Will Accelerate Adoption of Multi-Die Systems

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6 min read/Oct 04, 2023

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Industry Insights: How Collaboration Will Accelerate Adoption of Multi-Die Systems

By Synopsys Editorial Staff

Tags: Multi-Die System, Chip Design Insights

Samsung Foundry and Synopsys Accelerate Multi-Die System Design

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4 min read/Sep 21, 2023

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Samsung Foundry and Synopsys Accelerate Multi-Die System Design

By Henry Sheng, Jennifer Pyon

Tags: Multi-Die System, Product Spotlight, Chip Design Insights, Design

Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems

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7 min read/Sep 12, 2023

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Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems

By Filip Thoen, Leonard Drucker, Vivek Prasad

Tags: Multi-Die System, Chip Design Insights, Verification

Addressing Multi-Physics Effects for High-Performing Multi-Die Systems

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4 min read/Aug 22, 2023

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Addressing Multi-Physics Effects for High-Performing Multi-Die Systems

By Shekhar Kapoor, Kenneth Larsen

Tags: Multi-Die System, Chip Design Insights, Design

Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications

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8 min read/Aug 03, 2023

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Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications

By Jigesh Patel, Kenneth Larsen, Ian Land

Tags: Multi-Die System, Aerospace & Government, Chip Design Insights, Photonic

Key Considerations for Addressing Multi-Die System Verification Challenges

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6 min read/Aug 01, 2023

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Key Considerations for Addressing Multi-Die System Verification Challenges

By Arturo Salz, Dr. Johannes Stahl

Tags: Multi-Die System, Chip Design Insights, Verification

New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems

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4 min read/Jul 24, 2023

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New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems

By Taruna Reddy

Tags: Multi-Die System, Chip Design Insights, Verification

Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools

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7 min read/Jun 28, 2023

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Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools

By Dr. Johannes Stahl, Tim Kogel

Tags: Multi-Die System, Chip Design Insights, Verification, Virtual Prototyping

Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems

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5 min read/Jun 21, 2023

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Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems

By Dermott Lynch

Tags: Multi-Die System, Chip Design Insights, Design, Design Technology Co-Optimization

Synopsys and AMD Collaboration Achieves Significant Milestones for EDA Workloads

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4 min read/Jun 13, 2023

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Synopsys and AMD Collaboration Achieves Significant Milestones for EDA Workloads

By Andy Tai, Ramesh Narayanaswamy

Tags: Multi-Die System, Chip Design Insights, Design, Physical Implementation, Signoff, HPC, Data Center, Verification

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6 min read/May 23, 2023

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How Multi-Die Systems Transform the Semiconductor Industry

By Shekhar Kapoor

Tags: Multi-Die System, Chip Design Insights

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4 min read/May 22, 2023

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Designing Thermal Management Solutions for Multi-Die Systems

By Synopsys Editorial Staff

Tags: Multi-Die System, Chip Design Insights

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6 min read/May 18, 2023

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How Semiconductor Companies Use Multi-Die Systems

By Shekhar Kapoor

Tags: Multi-Die System, Chip Design Insights

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6 min read/Apr 26, 2023

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Celebrating the 76th Anniversary of the Transistor

By Victor Moroz, Rob Aitken

Tags: Multi-Die System, Chip Design Insights

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7 min read/Apr 25, 2023

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Upgrading 3DIC Packaging for Faster AI Inference with PSMC

By Kenneth Larsen

Tags: Multi-Die System, Chip Design Insights, Design

SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World

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5 min read/Apr 13, 2023

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SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World

By Rob van Blommestein

Tags: Multi-Die System, AI & Machine Learning, Silicon Lifecycle Management, Test, Chip Design Insights, Design, Verification, Inside Synopsys

UCIe Standard: Benefits & Requirements Explained

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4 min read/Apr 11, 2023

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UCIe Standard: Benefits & Requirements Explained

By Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Interface IP, Silicon IP

Discovering the Future of Multi-Die Systems

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4 min read/Mar 31, 2023

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Discovering the Future of Multi-Die Systems

By Shekhar Kapoor

Tags: Multi-Die System, Chip Design Insights

UCIe PHY IP Tape-Out on TSMC N3E Process

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4 min read/Mar 17, 2023

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UCIe PHY IP Tape-Out on TSMC N3E Process

By Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Silicon IP

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3 min read/Feb 22, 2023

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What are Multi-Die Systems?

By Shekhar Kapoor

Tags: Multi-Die System, Chip Design Insights

Boosting Chip Design & Verification with AI EDA Tools

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5 min read/Feb 07, 2023

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Boosting Chip Design & Verification with AI EDA Tools

By Shankar Krishnamoorthy

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Verification

How Systems of Chips Take Us From Smart to Smarter

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4 min read/Jan 19, 2023

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How Systems of Chips Take Us From Smart to Smarter

By Shankar Krishnamoorthy

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights

Why 2023 Holds Big Promise for Multi-Die Systems

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5 min read/Jan 17, 2023

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Why 2023 Holds Big Promise for Multi-Die Systems

By Shekhar Kapoor, Michael Posner

Tags: Multi-Die System, Chip Design Insights

3 Key Technologies that Will Transform Electronic Design in 2023

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6 min read/Jan 03, 2023

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3 Key Technologies that Will Transform Electronic Design in 2023

By Sanjay Bali

Tags: Cloud, Multi-Die System, Silicon Lifecycle Management, Chip Design Insights, Design, 3DIC Design

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10 min read/Dec 19, 2022

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2022's EDA & Chip Design Advancements

By Synopsys Editorial Staff

Tags: Multi-Die System, AI & Machine Learning, Prototyping, Emulation, Interface IP, Inside Synopsys, Cloud, Chip Design Insights, Design, Automotive, HPC, Data Center, Silicon IP, Verification

How 3DICs Are Sparking a New Wave of Product Innovation

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5 min read/Aug 22, 2022

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How 3DICs Are Sparking a New Wave of Product Innovation

By Shekhar Kapoor

Tags: Multi-Die System, Chip Design Insights

Multi-Chip Module Packaging Types for Multi-Die Designs

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6 min read/Jul 26, 2022

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Multi-Chip Module Packaging Types for Multi-Die Designs

By Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Silicon IP

Enhancing Chip Verification with AI and Machine Learning

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4 min read/Jul 12, 2022

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Enhancing Chip Verification with AI and Machine Learning

By Rob van Blommestein

Tags: Multi-Die System, Static Verification, AI & Machine Learning, Product Spotlight, Debug, Chip Design Insights, Simulation, HPC, Data Center, Verification, Formal Verification

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5 min read/Jul 11, 2022

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What is a SmartNIC?

By Rita Horner

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Security IP, Foundation IP, HPC, Data Center, Silicon IP, Verification, 3DIC Design

Data Center Journey: Data Volume Growth & Moore's Law

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6 min read/Jun 16, 2022

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Data Center Journey: Data Volume Growth & Moore's Law

By Mike Gianfagna

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, 5G Wireless, HPC, Data Center

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6 min read/Feb 16, 2022

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How to Design SoCs for the SysMoore Era

By Dr. Ming Zhang

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, 3DIC Design

Hyper-Convergent Chip Designs: News & Trends

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2 min read/Dec 15, 2021

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Hyper-Convergent Chip Designs: News & Trends

By Synopsys Editorial Staff

Tags: Multi-Die System, Chip Design Insights, Design, HPC, Data Center

What is Democratized Design? - Chip Design Process

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4 min read/Nov 29, 2021

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What is Democratized Design? - Chip Design Process

By Synopsys Editorial Staff

Tags: Multi-Die System, Chip Design Insights, Design

High-Performance Computing Drives Demand for Chiplets

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5 min read/Sep 14, 2021

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High-Performance Computing Drives Demand for Chiplets

By Kenneth Larsen

Tags: Multi-Die System, Chip Design Insights, Design, Interface IP, HPC, Data Center, Silicon IP

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5 min read/Aug 09, 2021

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What is a Multi-Die Chip Design?

By Kenneth Larsen, Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Design, Interface IP, Silicon IP

3DIC Design Optimization for Power, Performance & Area

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6 min read/Jul 13, 2021

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3DIC Design Optimization for Power, Performance & Area

By Kenneth Larsen

Tags: Multi-Die System, Chip Design Insights, Design

Die-to-Die Interfaces for Data Centers Bandwidth & Latency

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4 min read/Jun 02, 2021

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Die-to-Die Interfaces for Data Centers Bandwidth & Latency

By Manuel Mota

Tags: Multi-Die System, Chip Design Insights, Interface IP, HPC, Data Center, Silicon IP

Library Characterization Tool for Advanced Node SoC Design

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3 min read/Apr 20, 2021

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Library Characterization Tool for Advanced Node SoC Design

By Umang Doshi

Tags: Multi-Die System, Product Spotlight, Chip Design Insights, Design, Signoff

PrimeSim Continuum's Enables IC Hyperconvergence

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5 min read/Apr 19, 2021

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PrimeSim Continuum's Enables IC Hyperconvergence

By Tom Hsieh

Tags: Multi-Die System, AI & Machine Learning, Product Spotlight, Chip Design Insights, Design

FPGA Prototyping Powers the SoC Design & Verification Process

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4 min read/Apr 14, 2021

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FPGA Prototyping Powers the SoC Design & Verification Process

By Dr. Johannes Stahl

Tags: Multi-Die System, AI & Machine Learning, Product Spotlight, Prototyping, Chip Design Insights, Design, 5G Wireless, Verification

Integrated Chip Design Tools for IC Hyperconvergence

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4 min read/Apr 06, 2021

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Integrated Chip Design Tools for IC Hyperconvergence

By Raja Tabet, Anand Thiruvengadam

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, HPC, Data Center, Silicon IP

How 3DIC Design Tools Enhance Productivity & Performance

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5 min read/Mar 03, 2021

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How 3DIC Design Tools Enhance Productivity & Performance

By Shekhar Kapoor, Kenneth Larsen

Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Compiler

Die-to-Die Connectivity for High-Performance Computing

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7 min read/Nov 30, 2020

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Die-to-Die Connectivity for High-Performance Computing

By Scott Durrant

Tags: Multi-Die System, Chip Design Insights, HPC, Data Center, Silicon IP

Defining the AI Era with the IBM Research AI Hardware Center

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4 min read/Oct 20, 2020

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Defining the AI Era with the IBM Research AI Hardware Center

By Arun Venkatachar

Tags: Multi-Die System, AI & Machine Learning, Emulation, Interface IP, Virtual Prototyping, Chip Design Insights, Design, Manufacturing, Design Technology Co-Optimization, Processor Solutions, Silicon IP, Verification, 3DIC Design

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