Discover the Latest in AI, EDA, and Multi-Die Systems

Seeing a self-driving car navigate through streets without a driver hardly triggers a double take, especially in tech-rich regions. Neither does the experience of watching ChatGPT promptly write a story based on your one-sentence request. Each time we wake up our world is smarter, and silicon chips and software are at the heart of it all. To stay on top of the electronic industry’s latest technologies and trends, there’s no better opportunity than attending this month’s SNUG Silicon Valley, the largest technical conference of electronic design automation (EDA) users.

Back in person after going virtual last year, SNUG Silicon Valley takes place March 29 to 30 at the Santa Clara Convention Center. The conference promises to offer a rich two days of ideas, insight, and inspiration.

Want to understand why multi-die systems are proving to be the biggest disruption in computing? Or how AI is driving the next innovation wave for EDA? Or whether the semiconductor ecosystem is ready to support EDA workflows in the cloud?

While these are tough challenges to address, they’re not insurmountable thanks to engineering ingenuity. Applications like high-performance computing and AI are driving the need for new chip architectures, like multi-die systems. EDA flows, in turn, are adapting to provide what’s needed to drive the next wave of semiconductor innovation, including faster integration of heterogenous dies. In fact, as AI demands more of chips, AI is also increasingly being integrated into chip development flows, enabling enhanced engineering productivity and better silicon outcomes.